The semiconductor market value is projected to grow from USD 176 billion in 2021 and is projected to reach USD 273.9 billion by 2030; it is expected to grow at a CAGR of 5.6 % from 2021 to 2030.
The report contains 150+ pages with detailed analysis. The market report also covers the estimated market sizes and trends for different countries across major regions, globally.
Passive and interconnecting electronic components are used as essential parts of electronic devices, such as smartphones, computers, electrical home appliances, and gaming consoles. They are considered the backbone of computers, consumer electronics, telecommunications, and many other industries. It includes sockets, connectors, printed circuit boards, relays, switches, and many others.
Crucial factors accountable for market growth are:
- Rapid surge in demand for consumer electronics products will trigger the market growth.
- The increase in demand for 5G network services.
- The integration of internet of things (IoT) and automation with the Passive And Interconnecting Electronic Components.
- Government initiative to encourage the development of robust 5G network infrastructure.
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Report Scope of the Passive and Interconnecting Electronic Components Market
| Report Highlights | Details |
| Market Size | USD 273.9 Billion by 2030 |
| Growth | CAGR of 5.6% From 2021 to 2030 |
| Largest Market | Asia Pacific |
| Base Year | 2021 |
| Forecast Period | 2021 to 2030 |
| Segments Covered | Component, Application |
| Regional Scope |
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Research Objective
the market revenue/volume with the help of widespread quantitative and qualitative insights, and forecasts of the market. This report presents breakdown of market into forthcoming and niche segments. Additionally, this research study gauges market revenue growth and its drift at global, regional, and country from 2017 to 2020. This research report evaluates semiconductor market on a global and regional level. It offers thorough analysis of market status, growth and forecast of the global semiconductor market for the period from 2017 to 2030. This research study offers historic data for years 2017 to 2020 along with a forecast from 2021 to 2030 based on value.
This report also provides detailed company profiles of the key market players. This research report also highlights the competitive landscape of the semiconductor market and ranks noticeable companies as per their occurrence in diverse regions across globe and crucial developments initiated by them in the market space. This research study also tracks and evaluates competitive developments, such as collaborations, partnerships, and agreements, mergers and acquisitions; novel product introductions and developments, promotion strategies and Research and Development (R&D) activities in the marketplace. The competitive profiling of these players includes business and financial overview, gross margin, production, sales, and recent developments which can aid in assessing competition in the market.
Report Highlights
- The capacitor passive segment accounted for more than 36% revenue share in 2020.
- The consumer electronics application segment of the Passive And Interconnecting Electronic Components Market is estimated to lead the market with a market share of more than41% in 2020.
- By Geography, Asia Pacific is expected to lead the market contributing a revenue share of more than USD 97.1 billion in 2021 owing the presence of major market players in the region.
Market Dynamics
Driver
The rise in demand for the deployment of 5G network services across the world is a major factor that is estimated to drive the growth of the Passive And Interconnecting Electronic Components. Also, the integration of automation with the electronics components is yet another factor that fosters the market growth. For instance, On 16th September 2021, The new TCO Series high-temperature, automotive-grade polymer chip capacitors, which are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements, have been released by AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions.
Restraint
The major restraining factor that will negatively impact the growth of the Passive And Interconnecting Electronic Components Market includes drop in the global commodity prices and the surge in complexity of the passive and interconnecting electronic components in order to ensure high functionality.
Opportunity
The desire for availing the remote communication facilities and the implementation of the 5G network infrastructure across the globe are the factors that is expected to find huge growth opportunities which will trigger the market growth.
Challenges
The increase in complexity of the passive and interconnecting electronic components in order to provide high functionality is the major challenge encountered by the passive and interconnecting electronic components market that is anticipated to hinder the market growth.
Recent Developments
- On 14th July 2021, A new 3-D interactive connectivity application has been released by AVX Corporation, a major manufacturer and provider of innovative electronic components and interconnect, sensor, control, and antenna systems. The new 3-D interactive interconnect application, which is available on the AVX website and can be accessed via computer, tablet, or smartphone, gives users several intuitive ways to access a comprehensive and visually engaging suite of product information for an extensive selection of its proven portfolio of board-to-board, wire-to-board, and wire-to-wire connectors, including application examples spanning seven market segments; interactive, animated, and annunciated, 3-D product renderings; and relevant product pages, datasheets, and catalogs.
- On 26th October 2021, The ADL3225VM inductors from TDK Corporation are now available for use in automobile Power over Coax (PoC) systems. These inductors, which have dimensions of 3.2 x 2.5 x 2.5 mm (L x W x H), are a tiny alternative for designers wanting to minimise vehicle weight as manufacturers add more sensors and cameras to accommodate expanding automotive and advanced driver-assistance systems (ADAS) applications.
- On 21st September 2021, Fujitsu Components has introduced a line of USB dongles to complement its existing IoT products. The FWM8BLZ09x USB dongles, which have built-in Massive network connectivity, are a simple and cost-effective solution to add Wirepas Massive Mesh Anchor or Tag functionality to any equipment with a USB port. They can also provide Massive Mesh Sink functionality to any existing gateway that runs Wirepas software.
- On 29th June 2021, Fujitsu Components America, Inc. has introduced a new mesh network and multi-sensor unit family with built-in Wirepas Massive network connectivity and long battery life. The nodes make dense, large-scale network installations possible for a variety of industrial monitoring IoT applications in offices, factories, warehouses, hospitals, and schools, among other places.
- On 15th September 2021, Reality AI and Fujitsu Component Limited have established a partnership to provide Fujitsu Component’s contactless vibration sensor to manufacturing and industrial applications. Reality AI’s RealityCheck AD for industrial anomaly detection will be demonstrated live at the forthcoming Sensors Converge Expo in San Jose, CA, from September 21 to 23.
Read Also: Semiconductor Market Value to Reach US$ 772.03 Billion By 2030
Key Companies Profiled
The global Passive And Interconnecting Electronic Components Market are characterized by the presence of various small and big players. The major market players include AVX Corporation; Vishay Intertechnology, Inc.; Mouser Electronics, Inc.; Murata Manufacturing Co., Ltd.; TDK Corporation; Taiyo Yuden Co., Ltd.; Samsung Electro-Mechanics; Hosiden Corporation.; Yageo Corporation; Nichicon Corporation; Panasonic Corporation; Fujitsu Component Limited; Fenghua (HK) Electronics Ltd.; Rohm Co., Ltd.; United Chemi-Con; TE connectivity; and Molex Incorporated. As the market is competitive in nature, the players are indulged in rapid adoption of advanced technologies to improve connectivity and in raising their competitive share by means of strategic initiatives like mergers, new products and acquisitions.
Segments Covered in the Report
By Component
- Passive
- Resistors
- Capacitors
- Inductors
- Transformers
- Diode
- Interconnecting
- PCB
- Connectors/Sockets
- Switches
- Relays
- Others
By Application
- Consumer Electronics
- Mobile Phones
- Personal Computers
- Home Appliances
- Audio and Video Systems
- Storage Devices
- Others
- IT & Telecommunication
- Telecom Equipment
- Networking Devices
- Automotive
- Driver Assistance Systems
- Infotainment Systems
- Others
- Industrial
- Mechatronics and robotics,
- Power Electronics
- Photo Voltaic Systems
- Others
- Aerospace & Defense
- Aircraft systems
- Military Radars
- Others
- Healthcare
- Medical Imaging Equipment
- Consumer Medical Devices
- Others
- Others
By Geography
- North America
- U.S.
- Canada
- Mexico
- Europe
- U.K.
- Germany
- France
- Russia
- Italy
- Spain
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Thanks for reading you can also get individual chapter-wise sections or region-wise report versions such as North America, Europe, or the Asia Pacific.
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